FUW TRENDS IN SCIENCE & TECHNOLOGY JOURNAL
(A Peer Review Journal)
e–ISSN: 2408–5162; p–ISSN: 2048–5170
keywords: Alloy, deep eutectic solvent, electrodeposition, ionic liquid
The electrolytic depositions of zinc (Zn), nickel (Ni) and Zn/Ni alloy on copper substrates from two novel deep eutectic solvents (Reline and Ethaline) have been carried out. Using cyclic voltammetry, the electrochemical stripping response of the metal ions in the eutectic solvents at different temperatures and scan rates were recorded. In both solvents, the voltammograms results revealed that the deposition of Zn and Ni were both temperature and scan rate dependent. It was observed that the onset of voltage deposition and dissolution of the two metals were different in the solvents. However, more deposition occurred in ethaline deep eutectic solvent than reline due to high viscosity of the latter. The morphological analysis of the metal deposit using scanning electron microscopy (SEM) revealed bright images ofNi metal coating on the substrate compared to Zn coated surfaces. SEM micrograph of metal deposit in the presenceof additives was found to produce crackson the surface of the substrates.
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